AMOLED 製造工程レポート ver.2 発刊

『AMOLED製造工程レポート』はAMOLEDを中小型と大型に分けて構造と製造工程を分析しており、さらに中小型AMOLEDの検査工程も図式化したため各メーカーではAMOLEDの全般的な構造や重要工程を把握できるレポートです。

今回発刊されたAMOLED製造工程レポートバージョン2はバージョン1にギャラクシーS10に適用されたHIAA (hole in active area) OLED工程とLTPO TFT工程を始めとして新製造工程技術を追加されました。

本レポートはパネルメーカーだけでなく装備と部品素材メーカーが最近のAMOLED製造工程を理解するための必読レポートです。

目次
1. AMOLED Structure
1.1 Mobile device panel structure
1.2 TV device panel structure
1.3 Substrate
1.4 TFT
1.5 Color Filter
1.6 OLED Pixel
1.7 Encapsulation
1.8 Touch Screen Panel
1.9 Module

2. TFT Manufacturing Process
2.1 LTPS TFT manufacturing equipment layout
2.2 LTPS TFT basic manufacturing process
2.3 Galaxy S10’s LTPS TFT manufacturing process
2.4 Oxide TFT basic manufacturing process
2.5 LG OLEDTV’s Oxide TFT manufacturing process
2.6 TFT inspection and measurement process

3. OLED Pixel and Encapsulation Manufacturing Process
3.1 OLED Pixel and Encapsulation manufacturing equipment layout
3.2 Mobile Rigid OLED manufacturing process
3.3 Mobile Flexible OLED manufacturing process
3.4 TV WRGB device manufacturing process
3.5 Solution process OLED manufacturing process
3.6 OLED Pixel inspection and measurement process
3.7 Encapsulation inspection and measurement process

4. Cell Manufacturing Process
4.1 Cell manufacturing equipment layout
4.2 Mobile Rigid OLED manufacturing process
4.3 Mobile Flexible OLED manufacturing process
4.4 Cell inspection and measurement process

5. Module Manufacturing Process
5.1 Module manufacturing equipment layout
5.2 Mobile Rigid OLED manufacturing process
5.3 Mobile Flexible OLED manufacturing process
5.4 Module inspection and measurement process

6. New technology Manufacturing process
6.1 LTPO manufacturing process
6.2 Camera HIAA (hole in active area) manufacturing process
6.3 Flexible_on cell touch manufacturing process
6.4 Foldable module manufacturing process
6.5 QD-OLED manufacturing process

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